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(僅限聯盟會員免費參與)2016年8月25日 與2016年8月26日英文專題演講及座談會
發佈日期:2016-08-19 04:44:01

時間:8/25/2016 (星期四) 8/26/2016 (星期五)

地點:國立清華大學台達館地下一樓璟德廳

參加對象:僅限聯盟會員(請務必攜帶名片,以利判別為聯盟會員)

    額:由於座位有限,請於 2016/8/23前上網報名http://goo.gl/forms/yfaIfF44UY
    用:僅聯盟會員免費,但不含手冊、論文集、餐點與晚宴
 
活動內容(中華民國微系統暨奈米科技協會合辦,僅嘉惠聯盟會員免費參與
Prof. Tayfun Akin: Commercialization Experience of Fabless Infrared CMOS Microbolometers and Other Innovative MEMS and Semiconductor Products
This talk will present the start-up experience, R&D progress, and business model of the fabless semiconductor and MEMS companies that are established as spin-off/start-up companies from METU-MEMS Center. The talk will highlight Mikrosens that has developed cost-effective, patented, CMOS-based MEMS uncooled microbolometer infrared sensors for a wide range of infrared imaging applications, including automotive, security, machine vision, and consumer electronics. Unlike current approaches of competitors that require expensive and complex processes at dedicated fabs, Mikrosens’ CMOS microbolometer is developed to be truly fabless and to be produced at any standard CMOS and/or MEMS foundry, leading to cost advantage, simplicity, and flexibility. Mikrosens’s CMOS microbolometer approach does not require special high TCR materials and allows to use wafer level vacuum packaging technologies of high volume CMOS/MEMS foundries, such as AlGe. The talk will also highligh another fabless company, Mikro-Tasarim, which has developed high-performance Readout Integrated Circuits (ROICs) and their driver/digitizer ASICs for hybrid/monolithic, cooled/uncooled detectors in UV, Visible, NIR, SWIR, MWIR, and LWIR wavelengths. To highlight its capabilities, its CTIA ROICs for SWIR FPAs will be introduced, as these ROICs show a read noise performance of 5-e, which is about an order of magnitude smaller than the state-of-the-art counter parts in the world market. The talk will also summarize the other spin-off companies established based on the research achievements of METU-MEMS Center, including gyroscopes showing performances below 1degree/hour, accelerometers showing performances below 10ug with above 130dB dynamic range, RF MEMS switches operating above 12 billion cycles, and innovative and patented BioMEMS devices for cancer cell detection and for cochlear implants.
Prof. David Horsley: Piezoelectric Micromachined Ultrasonic Transducers in Consumer Electronics; the Next Little Thing?
Micromachined ultrasonic transducers (MUTs) are best known for their use in medical imaging, a field where imaging performance dominates over features such as transducer size, weight, power consumption and cost. In comparison, these features are the main drivers for the success of the MEMS sensors used in consumer electronics and automotive applications, such as pressure sensors, accelerometers, gyroscopes, and microphones. These MEMS sensors replaced their conventional counterparts in existing applications and, more important, enabled novel and unexpected applications (such as smart phones, toys, fitness trackers, etc.) where low cost, small size, light weight, and ultra-low power consumption are critical. In this talk, I will describe MEMS ultrasonic sensors based on piezoelectric MUTs (PMUTs) intended for consumer electronics applications such as range-finding and fingerprint sensing. A common characteristic of these applications is that they require manufacturing at high volume with relatively low cost. We have developed air-coupled ultrasonic sensors based on PMUTs that operate at 10 microwatts. Relative to optical sensors, these ultrasonic sensors have the advantage of very low power consumption and long range (> 1 m). In related research, we demonstrated a 500 DPI ultrasonic fingerprint sensor that has similar resolution to Apple’s TouchID sensor but the added advantages that it is capable of imaging wet or oily fingers and can image the dermis beneath the surface of the finger.
 
時間
活動內容
講員與主持人
8/25 (Thur.)
9:00-10:00
Commercialization Experience of Fabless Infrared CMOS Microbolometers and Other Innovative MEMS and Semiconductor Products
Prof. Tayfun Akin, METU, Turkey
8/25 (Thur.)
14:30-15:30
Piezoelectric Micromachined Ultrasonic Transducers in Consumer Electronics; the Next Little Thing?
Prof. David Horsley, UC Davis. US
8/26 (Fri.)
11:00-12:30
Panel Discussion: Bridging MEMS Design Houses and Foundries for Successful Commercialization
徐萬泰技術長,TXC
鄭鈞文經理,TSMC
陳翁宜副處長,UMC
謝哲偉副總,APM
吳名清執行長,GlobalMEMS
吳嘉昱副處長,Richtek (立錡)
孫志銘副理,Pxiart (原相)
 
 

 

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